Apple Watch Series 2 Teardown Reveals 32 Percent Larger Battery, Sticky Waterproofing Seals | 25 Pin Connectors

[G06F] ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

[H01L] SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR (use of semiconductor devices for measuring G01; resistors in general H01C; magnets, inductors, transformers H01F; capacitors in general H01G; electrolytic devices H01G 9/00; batteries, accumulators H01M; waveguides, resonators, or lines of the waveguide type H01P; line connectors, current collectors H01R; stimulated-emission devices H01S; electromechanical resonators H03H; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R; electric light sources in general H05B; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K; use of semiconductor devices in circuits having a particular application, see the subclass for the application) [2]

Inventor(s): Daniel Edward Middleman (The Colony, TX) Assignee(s): BANK OF AMERICA CORPORATION (Charlotte, NC) Law Firm: Moore Van Allen PLLC (6 non-local offices) Application No., Date, Speed: 14878621 on 10/08/2015 (1286 days app to issue)

Editor’s Note: From youth soccer to adult league softball, if it’s being played in Canyon County, this is the space for it. Community Connector will run Tuesdays and is dedicated to sports being played around the community. Send your announcements, photos and results to sports@idahopress.com to be featured in this space. Please include “Community Connector” in the subject line. Deadline for submissions is at noon on Mondays.

Inventor(s): Christopher Foskey (Fort Worth, TX), Jared Mark Paulson (Fort Worth, TX), Jeffrey Bosworth (Fort Worth, TX), Joel McIntyre (Fort Worth, TX), Michael Burnett (Fort Worth, TX), Paul K. Oldroyd (Fort Worth, TX) Assignee(s): Bell Helicopter Textron Inc. (Fort Worth, TX) Law Firm: Lawrence Youst PLLC (Local) Application No., Date, Speed: 15161215 on 05/21/2016 (1039 days app to issue)

It's interesting that in the US and UK, Nvidia's 1060 3GB is priced very aggressively, while in Europe the new GTX 1650 ends up as the best Nvidia value right now. But regardless of market, if you're just looking at bang for the buck, AMD's RX 570 4GB can't be beat. I keep expecting inventory of that card to dry up, leading to higher prices, but it's been at or below $130 since the beginning of 2019. The only thing likely to remove RX 570 (and 580) from the market will be when AMD starts shipping Navi, currently rumored for July 7, but we'll have to wait and see.

MIX IT UP MONDAYS: Steve Meek 268-227=687, Travis Valentine 233, Bridgette Longwill 222=552, Trish Jerome=504, Jimmy Longwill 268, Jake Alvey 236.

A collaboration of the Dallas Regional Chamber and D Magazine Partners, Dallas Innovates is an online news platform covering what's new + next in Dallas - Fort Worth innovation.

On Saturday, a group of about 20 children spent their weekend learning the rules of the road from the experts themselves.

Inventor(s): Kiran Makhijani (Los Gatos, CA), Renwei Li (Fremont, CA) Assignee(s): Futurewei Technologies, Inc. (Plano, TX) Law Firm: Conley Rose, P.C. (3 non-local offices) Application No., Date, Speed: 16171745 on 10/26/2018 (158 days app to issue)

Abstract: In various embodiments, different mobile phones are provided, comprising: a touchscreen including a backlight; a near field communication interface; at least one non-transitory memory storing instructions; and one or more processors in communication with the touchscreen, the near field communication interface, and the at least one non-transitory memory, wherein the one or more processors execute the instructions to initiate various capabilities and/or functionalities in connection with a lock screen displayed on the touchscreen.

LPKF has published an article on Laser Induced Deep Etching (LIDE) for thin glass processing. Due to its properties, glass is an interesting material for many areas of advanced IC and wafer level packaging. For a long time, it was considered very difficult to process. Production-related surface defects have given glass the reputation of being susceptible to brittle fracture and thus, at best, suitable for simple packaging tasks.